Applied Materials, Inc., based in Santa Clara, California, and French technology research institute CEA-Leti, headquartered in Grenoble, France, have announced an expanded phase in their longstanding collaboration, focusing on accelerating innovation in specialty semiconductors. According to a joint statement released on June 16, 2025, the two organizations signed a memorandum of understanding (MOU) to further develop their joint laboratory located at CEA-Leti’s Grenoble campus. The initiative is designed to address critical infrastructure challenges faced by data centers, especially as demand for specialized chips in high-growth markets intensifies.
The expanded joint lab will have enhanced capabilities through new equipment, extending its focus beyond individual semiconductor processing steps to the research and development of advanced specialty device architectures. This will include the addition of advanced packaging tools, facilitating the heterogeneous integration of chips manufactured with different wafer types and process nodes. The aim is to enable innovative classes of specialty semiconductor devices for a diverse set of applications ranging from industrial automation and electric vehicles to Internet of Things (IoT), communications, automotive, power, sensor technology, and beyond.
Specialty chips play a crucial role in managing data and power distribution within data centers, which are increasingly powered by artificial intelligence (AI) technologies. The rapid growth in digital infrastructure requirements has underscored the need for more energy-efficient chips to support the sustainable expansion of AI data centers worldwide.
Equipped with Applied Materials’ 200mm and 300mm wafer processing systems, the joint lab leverages CEA-Leti’s expertise in materials evaluation and device validation. The upgraded facility will feature a broad array of wafer processing systems coupled with evaluation tools for new materials and device structures. This infrastructure is expected to speed innovation in key semiconductor markets, notably the ICAPS segments (IoT, Communications, Automotive, Power, and Sensors).
In an official comment, a corporate vice president and general manager at Applied Materials stated, “Applied Materials and CEA-Leti have a long history of successful collaboration, and we are excited to strengthen our capabilities for accelerating innovation and commercialization of specialty chips. Our combined expertise will help foster breakthroughs and push the boundaries of semiconductor technology, contributing to sustainable advancements in a range of critical applications.”
Echoing this sentiment, a CEA-Leti spokesperson noted, “The first phase of this expanded collaboration laid important groundwork for addressing challenges in specialty semiconductor production. The joint lab’s new focus on solutions for AI infrastructure reflects our shared commitment to making technological progress that meets both industrial and societal needs. Our extended collaboration also leverages our complementary strengths to accelerate innovation at the system level while supporting sustainable growth in the semiconductor sector.”
This partnership builds on more than a decade of joint development programs between the two organizations, spanning advanced metrology, memory material applications, optical devices, novel bonding techniques, materials deposition, and chemical-mechanical planarization. The initiative exemplifies a model for global collaboration designed to hasten the commercialization of new chip technologies, drawing upon work occurring at innovation centers worldwide. Additional background on the December 2023 announcement of their joint lab and its expansion can be found on Applied Materials’ investor site.
Applied Materials is recognized internationally for its role as a leading supplier of materials engineering solutions used in the fabrication of nearly every advanced chip and display. The company’s expertise spans atomic-scale modification of materials on an industrial scale, which helps customers realize cutting-edge electronics technologies. CEA-Leti is one of Europe’s leading applied research institutes in the microelectronics sector, noted for pioneering miniaturization and energy transition technologies, and for its robust track record in technology transfers from research laboratories to industry.
The expansion of the CEA-Leti and Applied Materials joint laboratory is anticipated to make significant contributions to the semiconductor ecosystem in Grenoble, solidifying the region’s position as a leading hub for collaborative semiconductor innovation. The joint efforts are poised to support global advancements in energy-efficient, high-performance digital infrastructure and specialty chip technology.